Thermal Analysis of a Local Automation Unit in Marine Integrated Electrical Power Systems Using Domestic Components

Abstract

we studied the development of local automation devices (LADs) for marine integrated electric power systems (IEES) under conditions of technological sovereignty requirements in the Russian shipbuilding industry. We focused on LAD prototypes based on the domestic microcontroller K5500VK018 and analyzed thermal constraints associated with their operation in harsh marine environments. We examined heat dissipation under passive ventilation conditions at ambient air temperatures up to 60 ^∘C and evaluated the thermal state of the devices. We also optimized the enclosure design to prevent overheating of critical components.
We used numerical simulation of conjugate heat transfer and fluid dynamics implemented in SolidWorks Flow Simulation. We performed grid convergence analysis, accounted for thermal radiation using the Discrete Transfer method, and incorporated anisotropic thermal properties of printed circuit board materials. We found that the baseline enclosure design caused the K5500VK018 microcontroller to exceed its maximum allowable operating temperature. We proposed a modified enclosure design with additional ventilation openings.
We showed that the modified design increased the mass airflow rate in the heat-generating zone by 57.5% and reduced the maximum microcontroller temperature to 84.48 ^∘C at an ambient temperature of 60 ^∘C (limit: 85 ^∘C). We demonstrated that the proposed design ensures reliable operation of the device without active cooling systems or heat sinks. The results confirm the feasibility of mass production of domestic LADs for marine IEES and indicate improved technological independence in the context of global supply chain instability.